JPH0521342B2 - - Google Patents

Info

Publication number
JPH0521342B2
JPH0521342B2 JP60273368A JP27336885A JPH0521342B2 JP H0521342 B2 JPH0521342 B2 JP H0521342B2 JP 60273368 A JP60273368 A JP 60273368A JP 27336885 A JP27336885 A JP 27336885A JP H0521342 B2 JPH0521342 B2 JP H0521342B2
Authority
JP
Japan
Prior art keywords
silicone resin
electronic component
wiring board
filled
frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP60273368A
Other languages
English (en)
Japanese (ja)
Other versions
JPS62133741A (ja
Inventor
Yukio Yamaguchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd
Priority to JP27336885A priority Critical patent/JPS62133741A/ja
Priority to US06/900,532 priority patent/US4709301A/en
Priority to EP86112244A priority patent/EP0214621B1/en
Priority to DE86112244T priority patent/DE3688164T2/de
Publication of JPS62133741A publication Critical patent/JPS62133741A/ja
Publication of JPH0521342B2 publication Critical patent/JPH0521342B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
    • H01L23/18—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device
    • H01L23/24—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device solid or gel at the normal operating temperature of the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1517—Multilayer substrate
    • H01L2924/15182—Fan-in arrangement of the internal vias
    • H01L2924/15184—Fan-in arrangement of the internal vias in different layers of the multilayer substrate

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP27336885A 1985-09-05 1985-12-06 パツケ−ジ Granted JPS62133741A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP27336885A JPS62133741A (ja) 1985-12-06 1985-12-06 パツケ−ジ
US06/900,532 US4709301A (en) 1985-09-05 1986-08-26 Package
EP86112244A EP0214621B1 (en) 1985-09-05 1986-09-04 A package comprising a substrate and at least one electronic component
DE86112244T DE3688164T2 (de) 1985-09-05 1986-09-04 Packung mit einem Substrat und mindestens einem elektronischen Bauelement.

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP27336885A JPS62133741A (ja) 1985-12-06 1985-12-06 パツケ−ジ

Publications (2)

Publication Number Publication Date
JPS62133741A JPS62133741A (ja) 1987-06-16
JPH0521342B2 true JPH0521342B2 (en]) 1993-03-24

Family

ID=17526925

Family Applications (1)

Application Number Title Priority Date Filing Date
JP27336885A Granted JPS62133741A (ja) 1985-09-05 1985-12-06 パツケ−ジ

Country Status (1)

Country Link
JP (1) JPS62133741A (en])

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0407585A4 (en) * 1988-07-15 1992-06-10 Toray Silicone Co. Ltd. Semiconductor device sealed with resin and a method of producing the same
US5274913A (en) * 1991-10-25 1994-01-04 International Business Machines Corporation Method of fabricating a reworkable module

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59171343U (ja) * 1983-04-28 1984-11-16 株式会社デンソー 混成集積回路装置
JPS60116151A (ja) * 1983-11-28 1985-06-22 Matsushita Electric Works Ltd 電子部品の封止法
JPS6120771U (ja) * 1984-07-09 1986-02-06 日本フエラス工業株式会社 サツシ枠の建付装置

Also Published As

Publication number Publication date
JPS62133741A (ja) 1987-06-16

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